Inspection on the outer packaging materials to make sure it isn’t damaged. This process also includes checking ESD protection, the humidity indicator card (HIC), passed H20 test, correct MSL packaging. All documentation and certification relevant to the product be examined.
This inspection verifies the characteristics of parts in order to evaluate quality and originality. This includes inceptions such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.
This Tests will verify electrical operating conditions of active and passive components on various types of components from DC limited function to full DC/AC function. We can simulate test conditions depending on industry compliance requirements.
Available to verify that the solder ability of a lead component will meet the requirements established by standard. This will determine that storage/environmental conditions have had no adverse effect (oxidation) on the ability to solder components to an interconnecting substrate.
Decapsulation tests can be provided for customers to ensure that the device is produced by the original manufacturer. This destructive test will expose the die, and characteristics such as die markings, metalization damage due to ESD or corrosion will be verified.
X-ray inspections are non-destructive tests to verify the bond wire connections, die size comparison and ESD damaged. X-Ray are performed base on AS5553 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device.